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Back to topThe Elfnet Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects (Paperback)
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Description
1. Deformation and Fatigue of Solders.- 2. Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints.- 3. Thermal Fatigue Analysis.- 4. Electrochemical Behavior of Solder Alloys.- 5. Void Formation by Kirkendall Effect in Solder Joints.- 6. Tin Whiskers.- 7. Electromigration in Solder Interconnects.- 8. Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold.- 9. Reliability of Electronic Assemblies under Mechanical Shock Loading.- 10. Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration.- 11. Lead Free and Other Process Effects on Conductive Anodic Filamentation (CAF) Resistance of Glass Reinforced Epoxy Laminates.- 12. PCB Delamination.- 13. Excessive Warpage of Large Packages during Reflow Soldering.- 14. Popcorn Cracking.- 15. Thermal Capability of Components.